* Rename klte-common -> s3ve3g-common
* Drop fingerprint related blobs
* Drop camera shim, we do not need it
* Drop CameraWrapper to msm8226-common, as all msm8226 devices uses it
* Drop broadcom NFC
* Add buildable libpn547_fw.c, libpn547_fw_pku.c, libpn547_fw_platform.c dumped from stock S III Neo sources
* Update audio configs with stock S III Neo ones
* Update power_ext for S III Neo
* Drop broadcom WIFI for Qualcomm WIFI as we got a Qualcomm WIFI chip
* Drop broadcom bluetooth as we goot a Qualcomm bluetooth chip
* Update partitions for S III Neo
* Update rootdir for S III Neo
* Update overlay for S III Neo
* Update liblights path for S III Neo
* Update deviceperms for S III Neo
* Drop consumerir as we do not got an IR blaster
* Update TWRP files for S III Neo
Squash of the below two commits
* msm8226-common: Generate graphics vendor Makefile if missing
This allows to build CM without cloning vendor repos.
Change-Id: I87777485edc5f29c5899091176e55d28e36bb263
* msm8226-common: Fix blobs extraction with no vendor repos
Commit bff1cb1def84 ("msm8226-common: Generate graphics vendor
Makefile if missing") fixed only the generation of the makefiles,
but it didn't take care of the actual extraction of the blobs.
Change-Id: Idd38fbff554c0dac4b7cb8a867abb017bf37afc3
Change-Id: I3d6b70c8fdedfb624791fe3281c02df1c190d598