android_kernel_samsung_msm8976/arch/h8300
Arnd Bergmann 451a3c24b0 BKL: remove extraneous #include <smp_lock.h>
The big kernel lock has been removed from all these files at some point,
leaving only the #include.

Remove this too as a cleanup.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2010-11-17 08:59:32 -08:00
..
boot
include/asm Merge git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/tty-2.6 2010-10-22 19:59:04 -07:00
kernel BKL: remove extraneous #include <smp_lock.h> 2010-11-17 08:59:32 -08:00
lib
mm
platform
defconfig defconfig reduction 2010-08-14 22:26:53 +02:00
Kconfig Merge branch 'kbuild/rc-fixes' into kbuild/kconfig 2010-10-12 15:09:06 +02:00
Kconfig.cpu Update broken web addresses in arch directory. 2010-10-18 11:03:21 +02:00
Kconfig.debug
Kconfig.ide
Makefile
README Update broken web addresses in arch directory. 2010-10-18 11:03:21 +02:00

linux-2.6 for H8/300 README
Yoshinori Sato <ysato@users.sourceforge.jp>

* Supported CPU
H8/300H and H8S

* Supported Target
1.simulator of GDB
  require patches.

2.AE 3068/AE 3069
  more information 
  MICROTRONIQUE <http://www.microtronique.com/>
  Akizuki Denshi Tsusho Ltd. <http://www.akizuki.ne.jp> (Japanese Only)

3.H8MAX 
  see http://ip-sol.jp/h8max/ (Japanese Only)

4.EDOSK2674
  see http://www.eu.renesas.com/products/mpumcu/tool/edk/support/edosk2674.html
      http://www.uclinux.org/pub/uClinux/ports/h8/HITACHI-EDOSK2674-HOWTO
      http://www.azpower.com/H8-uClinux/

* Toolchain Version
gcc-3.1 or higher and patch
see arch/h8300/tools_patch/README
binutils-2.12 or higher
gdb-5.2 or higher
The environment that can compile a h8300-elf binary is necessary.

* Userland Develop environment
used h8300-elf toolchains.
see http://www.uclinux.org/pub/uClinux/ports/h8/

* A few words of thanks
Porting to H8/300 serieses is support of Information-technology Promotion Agency, Japan.
I thank support.
and All developer/user.