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https://github.com/team-infusion-developers/android_kernel_samsung_msm8976.git
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fc9499e55a
* Package version: T713XXU2BQCO Change-Id: I293d9e7f2df458c512d59b7a06f8ca6add610c99
36 lines
1.3 KiB
Makefile
36 lines
1.3 KiB
Makefile
#
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# Makefile for sensor chip drivers.
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#
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obj-$(CONFIG_THERMAL) += thermal_sys.o
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thermal_sys-y += thermal_core.o
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# governors
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thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += fair_share.o
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thermal_sys-$(CONFIG_THERMAL_GOV_STEP_WISE) += step_wise.o
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thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o
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# cpufreq cooling
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thermal_sys-$(CONFIG_CPU_THERMAL) += cpu_cooling.o
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# platform thermal drivers
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obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
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obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
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obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
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obj-$(CONFIG_EXYNOS_THERMAL) += exynos_thermal.o
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obj-$(CONFIG_DOVE_THERMAL) += dove_thermal.o
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obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
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obj-$(CONFIG_ARMADA_THERMAL) += armada_thermal.o
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obj-$(CONFIG_DB8500_CPUFREQ_COOLING) += db8500_cpufreq_cooling.o
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obj-$(CONFIG_INTEL_POWERCLAMP) += intel_powerclamp.o
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obj-$(CONFIG_THERMAL_TSENS8974) += msm-tsens.o
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obj-$(CONFIG_THERMAL_QPNP) += qpnp-temp-alarm.o
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obj-$(CONFIG_THERMAL_QPNP_ADC_TM) += qpnp-adc-tm.o
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obj-$(CONFIG_THERMAL_MONITOR) += msm_thermal.o msm_thermal-dev.o
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obj-$(CONFIG_LIMITS_MONITOR) += lmh_interface.o
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obj-$(CONFIG_LIMITS_LITE_HW) += lmh_lite.o
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obj-$(CONFIG_SUPPLY_LM_MONITOR) += supply_lm_core.o
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# Sec thermal cpu wear leveling
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obj-$(CONFIG_SS_THERMAL_CPU_WEAR_LEVEL) += ss_thermal.o
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